Newsroom

IMAPS Microelectronics

October 10-11, 2017

Raleigh Convention Center
Raleigh, North Carolina, USA
Booth #425

Join Rudolph at the IMAPS 50th International Symposium on Microelectronics! Learn more about Rudolph’s product suite for the demanding requirements of the advanced packaging market, including 2D/3D bump inspection, RDL and overlay metrology, and a lithography stepper specifically designed for advanced packaging. Turn data into useful insight with Rudolph’s proprietary software solutions including run-to-run control, fault detection and classification and yield management systems.