Newsroom

May 23, 2017

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Latest JetStep system order for high-resolution panel lithography includes industry-leading imaging capability down to two microns

Wilmington, Mass. (May 23, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for its JetStep S Lithography System for fan-out panel level processing. The system, which will ship in June 2017 to an outsourced assembly and test (OSAT) facility based in Asia, will be used to produce system-in-package (SiP) products that combine sensor, processor and memory functions for the automotive industry.

“Inherently large in size with a rectangular form factor, a SiP is ideally suited for panel manufacturing,” said Rich Rogoff, vice president and general manager of Rudolph’s Lithography Systems Group. “Panels can accommodate a higher number of SiPs, which reduces the cost of manufacturing advanced packages due to the rectangular shape and large surface area. Generally speaking, a typical panel would allow approximately 150 percent more devices to be processed compared to wafer-level processes. The JetStep S System was selected because of its ability to process very large panel sizes up to 650mm x 720mm and its large field size that optimizes throughput for larger packages.”

Rogoff continued, “We see an increasing number of manufacturers investing in panel processing technology across a variety of applications, including SiP and large die processing for multiple high-end technologies. This is an exciting transition for our customers and we are pleased that the JetStep system’s unique combination of imaging and handling capabilities is helping early adopters more quickly prove out the cost of ownership benefits of panel processing.”

Moving from round wafers to rectangular panels saves corner space, delivering a roughly ten-percent improvement in surface utilization. The larger size of the substrate and the improved fit between the mask and substrate maximizes the number of packages on a given substrate, which reduces the transfer overhead by a factor of five. Beyond advanced packaging lithography, Rudolph also offers process control solutions for panel manufacturing, including defect inspection and closed loop analytics software to drive tighter process capability and ramp to yield.

For more information about Rudolph’s systems and software, please visit http://www.rudolphtech.com. 

About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at http://www.rudolphtech.com

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Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefit to customers of Rudolph’s products, Rudolph’s ability to successfully innovate, develop new technologies and products and deliver products and services consistent with our customers’ demands and expectations as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, the company’s offered design enhancements may not necessarily translate into significant revenue and the challenges presented by the new product development and marketing. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2016 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

Contacts:
Investors:    
Steven R. Roth   
973.448.4302    
steven.roth@rudolphtech.com

Guerrant Associates
Laura Guerrant-Oiye
Principal
808.960.2642
lguerrant@guerrantir.com 

Trade Press:
Amy Shay
952.259.1794
amy.shay@rudolphtech.com